System and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers

ABSTRACT

A device and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers. The method includes dispensing liquid SOG through a dispenser nozzle, detecting liquid SOG outside of the dispenser nozzle, indicating the presence of liquid SOG in an abnormal length relative to the dispenser nozzle and adjusting a suck back (SB) valve to withdraw liquid SOG from the abnormal length.

BACKGROUND

Spin on glass (SOG) has a number of practical applications and benefitsin semiconductor device fabrication. For example, SOG is used as aninter-layer dielectric (ILD) capable of filling sub-micron gaps betweenmetal interconnects on a semiconductor device and being planarized. SOGcan also function as a passivation layer or a photoresist layer forlithographic circuitry definition. In semiconductor device fabrication,SOG is deposited in liquid drop form onto an upper surface of asemiconductor wafer, then the entire wafer is rotated to produce arelatively uniform coating. The SOG fills gaps in the semiconductorwafer, and once hardened (cured) with an appropriate application ofheat, SOG enables planarization of the surface. Planarization may be byetch-back, chemical mechanical polishing (CMP), or other suitablemethods. Cured SOG has similar insulating electrical properties tosilicon dioxide, which is often replaced by SOG, although SOG provides abenefit of an even lower dielectric constant. Deposition of SOG replacesa process step that may have used physical vapor deposition(sputtering), chemical vapor deposition (CVD), plasma-enhanced chemicalvapor deposition (PECVD) or the like, to deposit silicon dioxide orother similar materials. However, uniformity of deposition of SOG hasproven to be difficult, particularly when the SOG used is not aperfectly pure and uniform material.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference is now made to the following descriptions taken in conjunctionwith the accompanying drawings, in which:

FIG. 1A is a side view of a liquid spin-on glass (SOG) dispenserdispensing liquid SOG with SOG particles onto a semiconductor wafer;

FIG. 1B is a top view of the semiconductor wafer of FIG. 1A with aliquid SOG layer having SOG particles after spinning;

FIG. 2A is a side view of a liquid spin-on glass (SOG) dispenserdispensing liquid SOG with SOG clumps onto a semiconductor wafer;

FIG. 2B is a top view of the semiconductor wafer of FIG. 2A with aliquid SOG layer having SOG particles after spinning;

FIG. 3 is a schematic block diagram of a SOG dispensing system accordingto some embodiments; and

FIG. 4 is a flowchart of SOG dispensing according to some embodiments;

DETAILED DESCRIPTION

The making and using of various embodiments are discussed in detailbelow. It should be appreciated; however, that the present disclosureprovides many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare examples of specific ways to make and use, and do not limit thescope of the disclosure.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples or designate corresponding componentswith same last two digits, but with a different preceding digit ordigits. This repetition is for the purpose of simplicity and clarity ofidentification of corresponding objects and does not necessarily initself dictate a relationship between the various embodiments and/orconfigurations discussed. Moreover, the formation of a feature on,connected to, and/or coupled to another feature in the presentdisclosure that follows may include embodiments in which the featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed interposing the features, such thatthe features may not be in direct contact. In addition, spatiallyrelative terms, for example, “lower,” “upper,” “horizontal,” “vertical,”“above,” “below,” “up,” “down,” “top,” “bottom,” etc. as well asderivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,”etc.) are used for ease of the present disclosure of one feature inrelation to another feature. The spatially relative terms are intendedto cover different orientations of the device including the features.

FIG. 1A is a side view of a liquid spin-on glass (SOG) dispenser system100. The SOG dispenser system 100 includes a SOG dispenser 102 with adispenser nozzle 104 for dispensing liquid SOG 106 onto a semiconductorwafer 108. The liquid SOG 106 includes a type of liquid SOG such asmethylsiloxane, methylsilsesquioxane, phenylsiloxane,phenylsilsesquioxane, methylphenylsiloxane, methylphenylsilsesquioxane,silicate polymers, etc. The wafer 108 is supported by a rotatableplatter 110 rotated by a physically coupled electric motor (as shown inFIG. 3). In this example, the liquid SOG 106 includes particles 112. Theparticles 112 are undesirable impurities or SOG crystals in the liquidSOG that are initially dispensed in a random pattern but form a spiralpattern after spinning.

FIG. 1B is a top view of the semiconductor wafer 108 from FIG. 1A with adeposited liquid SOG layer 106 after spinning. A spiral pattern ofparticles 112 is illustrated. A center portion of the wafer 108 containsfewer particles 112 due to their higher density, while away from thecenter portion some areas have high numbers of particles 112 in thespiral pattern due to clumping. SOG 106 and particles 112 are presentbut not shown in the unused fringe areas 114 of the wafer 108.

FIG. 2A is a side view of the liquid spin-on glass (SOG) dispensersystem 200. The SOG dispenser system 200 includes a SOG dispenser 202with a dispenser nozzle 204 for dispensing liquid SOG 206 onto asemiconductor wafer 208. The liquid SOG 204 includes a type of liquidSOG such as methylsiloxane, methylsilsesquioxane, phenylsiloxane,phenylsilsesquioxane, methylphenylsiloxane, methylphenylsilsesquioxane,silicate polymers, etc. The wafer 208 is supported by a rotatableplatter 210 rotated by a physically coupled electric motor. In thisexample, the liquid SOG 106 includes SOG clumps 216. The clumps 216 areundesirable additional amounts of SOG that are dispensed in a randompattern.

FIG. 2B is a top view of the semiconductor wafer 208 from FIG. 2A with adeposited liquid SOG layer 206 after spinning. A bi-polar-resemblingpattern of SOG clumps 216 is illustrated in FIG. 2B. A center portion ofthe wafer 208 contains fewer clumps 216, while away from the centerportion two areas in particular have high numbers of clumps 216 in thebi-polar-resembling pattern. SOG 206 and clumps 216 are not shown in theunused fringe areas 214 of the wafer 208.

FIG. 3 is a schematic block diagram of a SOG dispensing system 300according to some embodiments. The SOG dispensing system 300 includes aSOG dispenser 302 with a dispenser nozzle 304 for dispensing liquid SOG306 onto a semiconductor wafer 308. Note that SOG 306 includes particles112 from SOG 106 and/or clumps 216 from SOG 206, as described herein.The wafer 308 is supported by a rotatable platter 310 rotated by aphysically coupled electric motor 318. In some embodiments, the SOGdispenser 302 is movable above a semiconductor wafer 308 for dispensingliquid SOG 306 through the SOG dispenser nozzle 304.

The SOG dispenser 302 receives liquid SOG 306 from a SOG supplyreservoir 320. The SOG supply reservoir 320 contains enough liquid SOG306 for SOG deposition onto multiple wafers 308, in some embodiments.SOG 306 from the SOG supply reservoir 320 is received by a suck backvalve (“SB valve”) 322 and carried from the SB valve 322 through aconnecting pipe 323 to the SOG dispenser 302. The SB valve 322 has aswitch valve 324 and an adjustment valve 326. The switch valve 324corresponds to roughly the upper half of the SB valve 322 and theadjustment valve 326 corresponds to roughly the lower half of the SBvalve 322. In some embodiments, the switch valve 324 is not springloaded. In some embodiments, the adjustment valve 324 is not springloaded.

The switch valve 324 of the SB valve 322 is coupled to the SOG supplyreservoir 320 and switches the SOG flowing through the SB valve 322 on,if the switch valve 324 is in an open position, or off, if the switchvalve 324 is in an closed position. The flow of SOG 306 is digitallycontrolled by a digital suck back valve controller (digital SBVcontroller) 328 that enables a degree of control over the flow of SOG306 in gradations between fully on and fully off. The digital SBVcontroller 328 controls the switch valve 324 of the SB valve 322 througha switch valve control signal 330 that is transmitted to anelectromagnetic actuator in the switch valve 324. Similarly, the digitalSBV controller 328 controls the adjustment valve 326 of the SB valve 322through an adjustment valve control signal 332 that is transmitted to anelectromagnetic actuator in the adjustment valve 326. Increasing anamount of pressure applied by the actuator in the switch valve 324 inresponse to the switch valve control signal 330 progressively closes theswitch valve 324, while decreasing the amount of pressure applied by theactuator in the switch valve 324 progressively opens the switch valve324. SOG passing through the switch valve 324 of the SB valve 322 movespast the adjustment valve 326 of the SB valve 322.

In some embodiments, the adjustment valve 326 of the SB valve 322 iscontrolled by the digital SBV controller 328 to dispense SOG 306 orwithdraw SOG 306 (“suck back”) from the SOG dispenser 302. For example,increasing an amount of pressure applied by the actuator in theadjustment valve 326 of the SB valve 322 progressively closes theadjustment valve 326, using positive pressure to force SOG 306 out ofthe adjustment valve 326, while decreasing the amount of pressureprogressively opens the adjustment valve 326, using negative pressure tocohesively pull SOG 306 into the adjustment valve 326. If the switchvalve 324 is in a closed position and the adjustment valve 326 is beingprogressively opened by decreasing pressure applied to the adjustmentvalve 326 will withdraw or suck back SOG 306 from the SOG dispenser 302through the connecting pipe 323 by cohesive forces in the SOG 306,thereby preventing or improving the ability to prevent an excessiveamount of SOG 306 from being deposited onto a wafer 308, as can occurwith unintentional dripping. Withdrawing SOG 306 that would have beendeposited onto the wafer 308 reduces the amount of particles 112 and/orclumps 216 deposited onto the wafer, mitigating problems associated withparticles and/or clumps in SOG.

The SOG dispenser 302 is equipped with an emitter/detector pair 334,such as a laser/photodiode pair, to detect the position of the SOG 306.The SOG 306 hanging from the SOG dispenser 302 takes either a normal SOGlength 336 or an abnormal SOG length 338 in different circumstances. Inthe normal SOG length 336, the SOG 306 is held within or nearly withinthe nozzle 304 of the SOG dispenser 302 through capillary forces or theaction of the SB valve 322, or both. In the abnormal SOG length 338, SOG306 is in an undesirable SOG position relative to the nozzle 304,indicative of potential or actual unintentional dripping of SOG 306 onthe wafer 308. The normal SOG length 336 is interpreted herein as SOG306 not being in an undesirable SOG position, for example, in someembodiments, the normal SOG length 336 is less than the maximumpredetermined SOG length 338 and cannot equal or exceed 2 millimetersSOG hanging from the nozzle 304 if the nozzle is not actively dispensingSOG 306 on the wafer 308. Note that the maximum predetermined SOG length338 is determined based on a variety of factors including SOG 306 type,viscosity, temperature, pressure, nozzle 304 type, etc.

In some embodiments, unintentional dripping of SOG 306 causes anexcessive SOG dispensing condition associated with the presence ofparticles 112 and/or clumps 216 in the SOG. SOG 306 in the abnormallength 338 will block light in the emitter/detector pair 334 therebyproviding an electronic signal (or lack thereof) indicating the presenceof SOG 306 in the abnormal length 338, otherwise the electronic signalfrom the emitter/detector pair 334 will correspondingly indicate thatthe SOG 306 is in the normal length 336. Note that signals indicatingSOG 306 in the abnormal length 338 during intentional SOG dispensing areignored. A signal controller 340 receives a signal from theemitter/detector pair 334 indicating the normal length 336 or theabnormal length 338 of the SOG 306 with respect to the nozzle 304. Insome embodiments the signal controller 340 moves the emitter/detectorpair 334 in an up and down fashion to precisely determine the length ofany SOG 306 hanging from the nozzle A signal analysis circuit 342receives one or more signals from the signal controller 340 derived fromthe emitter/detector pair 334 and provides digital input to the digitalSBV controller 328. In some embodiments the emitter/detector pair 334produces an analog signal or signals instead of a digital signal orsignals. A fluid data calibration (FDC) sensor 344 provides a digitalindication to the digital SBV controller 328 regarding the dispensingduration timing and volume of SOG 306 being dispensed onto the wafer 308by the SOG dispensing system 300. In some embodiments the fluid datacalibration (FDC) sensor 344 produces an analog signal or signalsinstead of a digital signal or signals. A tool interlock circuit 345provides set operating parameters for the SOG dispenser 302 to thesignal analysis circuit 342 to determine if the SOG dispenser 302 is notoperating within set operating parameters. For example, if the SOGdispenser 302 is not operating within set operating parameters, the toolinterlock circuit 345 causes the digital SBV controller 328 to close theswitch valve 324 of the SB valve 322 and transmit an alarm signal.

In some other embodiments, the emitter/detector pair 334 is physicallymoved up and down and/or optically moved up and down, relative to thenozzle 304, with moving lenses, moving minors and/or moving standingacoustic waves, thereby scanning the SOG 306, to provide a more preciseindication of the length and the corresponding volume of SOG 306 outsidethe nozzle 304. Note that the abnormal length 338 of the SOG 306 inthese embodiments is a range of positions outside the nozzle 304. Forexample, the presence of SOG 306 hanging 2 millimeters or more below thenozzle 304 is considered to be in the abnormal length 338.

FIG. 4 is a flowchart of a SOG dispensing method according to someembodiments. At operation 446, liquid SOG 306 is dispensed through thedispenser nozzle 304 to begin the process of depositing a targetedamount of SOG onto the wafer 308. In some embodiments, a drop of liquidSOG 306 is dispensed approximately every 4.5 seconds until 12-13 dropsof SOG have been dispensed in approximately 55-60 seconds. In someembodiments, longer or shorter dispensing times and a greater or fewernumber of SOG 306 drops are used depending on wafer size and specifiedthickness of SOG.

At operation 448, liquid SOG 306 is detected outside of the dispensernozzle 304 at a time when the SOG should not be there, i.e., whenintentional dispensing is not occurring. In some embodiments, detectionis via the emitter/detector pair 334 or other sensing apparatus. Theundesirable presence of a drop of liquid SOG 306 is detected by SOGextending beyond the nozzle 304 opening and blocking light from thelaser from reaching the photodiode in the emitter/detector pair 334. Inother embodiments, the emitter/detector pair 334 is not stationary, butrather moves up and down to scan the presence of liquid SOG 306 outsidethe dispenser nozzle 304. In still other embodiments, other sensorapparatus detect liquid SOG 306 outside the dispenser nozzle 304, suchas detectors or emitter/detector pairs based on detection of changes insound, ultraviolet light, infrared light, radar, other portions of theelectromagnetic spectrum, magnetic fields, electrical fields, etc.

At operation 450, the liquid SOG dispensing system 300 indicates thepresence of liquid SOG 306 in an abnormal length 338 relative to thedispenser nozzle 304. In some embodiments, the system 300 indicates theabnormal presence of SOG 306 if the SOG is present at or beyond acertain point relative to the nozzle, such as if the emitter/detectorpair 334 is stationary. In other embodiments, the system 300 indicatesthe abnormal presence of SOG 306 including how great a length, e.g., 2millimeters below the nozzle 304, and/or volume of SOG 306 is presentoutside of the nozzle 304, such as in those embodiments wherein theemitter/detector pair 334 is not stationary and moves in a up and downfashion to scan for the presence of SOG 306 outside of the nozzle 304.

In operation 452, the signal analysis circuit receives the indication ofthe presence of liquid SOG 306 in an abnormal length 338 relative to thedispenser nozzle 304 and determines whether the SOG dispensing system300 is or is not operating outside set operating parameters. If the SOGdispensing system 300 is not operating outside set operating parameters,then in step 454 the digital SBV controller 328 adjusts the SB valve 322to withdraw the liquid SOG 306 present in the abnormal length 338 backto a normal length 336. If the SOG dispensing system 300 is operatingoutside set operating parameters, SOG dispensing is halted. In someembodiments, an alarm signal is transmitted and/or one or more signalsfrom the FDC sensor 344 are stored in the digital SBV controller 328,thereby enabling subsequent failure analysis and preventing or improvingthe ability to prevent further inappropriate SOG 306 dispensing and thecorresponding potential loss of valuable semiconductor wafers 308.

According to some embodiments, a method of depositing spin-on glass(SOG) onto a semiconductor wafer includes dispensing liquid SOG througha dispenser nozzle. The liquid SOG is detected outside of the dispensernozzle. The presence of liquid SOG in an abnormal length relative to thedispenser nozzle is indicated. Then an SB valve is adjusted to withdrawliquid SOG from the abnormal length.

According to some embodiments, a method of depositing spin-on glass(SOG) onto a semiconductor wafer includes dispensing liquid SOG througha dispenser nozzle. The liquid SOG is detected outside of the dispensernozzle with an emitter/detector pair that movably scans for the presenceof SOG. The presence of liquid SOG in an abnormal length relative to thedispenser nozzle is indicated. Then an SB valve is adjusted to withdrawliquid SOG from the abnormal length.

According to some embodiments, a liquid spin-on glass (SOG) depositingsystem includes a suck back (SB) valve physically coupled to the SOGsupply reservoir for receiving SOG, a SOG dispenser having a nozzle, theSOG dispenser physically coupled to the SB valve for receiving SOG, asensor positioned to detect SOG outside the nozzle and a digital SBvalve controller, the digital SB valve controller coupled to the sensorfor receiving signals from the sensor and to the SB valve forcontrolling operation of the SB valve.

According to some embodiments, a method of manufacturing a semiconductordevice includes dispensing liquid SOG through a dispenser nozzle. Theliquid SOG is detected outside of the dispenser nozzle. The presence ofliquid SOG in an abnormal length relative to the dispenser nozzle isindicated. Then an SB valve is adjusted to withdraw liquid SOG from theabnormal length.

A skilled person in the art will appreciate that there can be manyembodiment variations of this disclosure. Although the embodiments andtheir features have been described in detail, it should be understoodthat various changes, substitutions and alterations can be made hereinwithout departing from the spirit and scope of the embodiments.Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, and composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosed embodiments, processes, machines,manufacture, compositions of matter, means, methods, or steps, presentlyexisting or later to be developed, that perform substantially the samefunction or achieve substantially the same result as the correspondingembodiments described herein may be utilized according to the presentdisclosure.

The above method embodiment shows exemplary steps, but they are notnecessarily required to be performed in the order shown. Steps may beadded, replaced, changed order, and/or eliminated as appropriate, inaccordance with the spirit and scope of embodiment of the disclosure.Embodiments that combine different claims and/or different embodimentsare within the scope of the disclosure and will be apparent to thoseskilled in the art after reviewing this disclosure.

What is claimed is:
 1. A method of controlling deposition of liquidspin-on glass (SOG) onto a semiconductor wafer, comprising: detecting,using a first sensor, the liquid SOG outside of a dispenser nozzle in anabnormal length relative to the dispenser nozzle; adjusting, using acontroller, a suck back (SB) valve to withdraw liquid SOG from theabnormal length; comparing a sensed amount of liquid SOG deposited ontothe semiconductor wafer, from a second sensor, with at least oneoperating parameter prior to the adjusting; pausing sensing of an amountof liquid SOG dispensed onto the semiconductor wafer based on the sensedamount of liquid SOG deposited being outside the at least one operatingparameter; and storing at least one signal from the second sensor in thecontroller based on the sensed amount of liquid SOG deposited beingoutside the at least one operating parameter.
 2. The method of claim 1,wherein the detecting comprises sensing the liquid SOG with alaser/photodetector pair by indicating a change in laser light receivedby the photodetector.
 3. The method of claim 2, wherein the laser lightmovably scans for the presence of liquid SOG.
 4. The method of claim 1,wherein the detecting comprises sensing liquid SOG outside of thedispenser nozzle by a change in detected sound, infrared light or radar.5. The method of claim 1, wherein the detecting comprises sensing liquidSOG outside of the dispenser nozzle by a change in a detected magneticfield or electric field.
 6. The method of claim 1, further comprising:halting deposition of the liquid SOG onto the semiconductor wafer basedon the sensed amount of liquid SOG deposited being outside the at leastone operating parameter.
 7. The method of claim 1, further comprising:activating an alarm based on the sensed amount of liquid SOG depositedbeing outside the at least one operating parameter.
 8. The method ofclaim 1, wherein the adjusting the SB valve to withdraw the liquid SOGfrom the abnormal length comprises activating the SB valve with anelectromagnetic actuator.
 9. The method of claim 1, wherein theadjusting the SB valve to withdraw the liquid SOG from the abnormallength comprises transmitting a switch valve control signal to a firstelectromagnetic actuator and transmitting an adjustment valve controlsignal to a second electromagnetic actuator.
 10. The method of claim 1,wherein the adjusting comprises closing a switch valve in the SB valveand moving an adjustment valve in the SB valve.
 11. The method of claim1, wherein adjusting the SB valve comprises adjusting the SB valve usinga digital controller.
 12. A method of manufacturing a semiconductordevice, comprising: detecting, using a sensor, liquid SOG outside of adispenser nozzle in an abnormal length relative to the dispenser nozzle;adjusting, using a controller, a suck back (SB) valve to withdraw liquidSOG from the abnormal length; comparing a sensed amount of liquid SOGdeposited onto the semiconductor wafer from the dispenser nozzle with atleast one set operating parameter; and pausing sensing of a duration ofdispensing liquid SOG onto the semiconductor wafer based on the sensedamount of liquid SOG deposited being outside the at least one operatingparameter; and storing at least one signal in the controller based onthe sensed amount of liquid SOG deposited being outside the at least oneoperating parameter.
 13. The method of claim 12, wherein the detectingcomprises sensing the liquid SOG by detecting a change in light.
 14. Themethod of claim 12, wherein adjusting the SB valve comprises adjustingthe SB valve using a digital controller.
 15. A method of controllingdeposition of liquid spin-on glass (SOG) onto a semiconductor wafer, themethod comprising: dispensing, for a duration, the liquid SOG onto thesemiconductor wafer; determining, after the duration, a length of theliquid SOG outside of a dispenser nozzle using a sensor; adjusting,using a controller, a suck back (SB) valve to reduce the length ofliquid SOG if the length is below a predetermined threshold; comparing asensed amount of liquid SOG deposited onto the semiconductor wafer fromthe dispensing with at least one set operating parameter; and pausingsensing of a volume of liquid SOG dispensed onto the semiconductor waferbased on the sensed amount of liquid SOG deposited being outside the atleast one operating parameter; and storing at least one signal in thecontroller based on the sensed amount of liquid SOG deposited beingoutside the at least one operating parameter.
 16. The method of claim15, further comprising transmitting an alarm signal if the length isequal to or greater than the predetermined threshold.
 17. The method ofclaim 15, wherein determining the length of the liquid SOG comprisesmeasuring the length of the liquid SOG using an emitter/detector pair.18. The method of claim 17, wherein determining the length of the liquidSOG comprises translating the emitter/detector pair relative to thedispenser nozzle.
 19. The method of claim 17, wherein determining thelength of the liquid SOG comprises optically scanning theemitter/detector pair along an axis of the dispensing nozzle, andmaintaining a physical location of the emitter/detector pair.
 20. Themethod of claim 15, further comprising closing the SB valve if thelength is greater than or equal to the predetermined threshold.